Nick was born in Royal Oak, Michigan and was raised in Troy, Michigan. He attended the University of Detroit Mercy where he received his B.S. in Chemistry. At Detroit Mercy, he worked on Sonogashira cross-coupling reaction methodology under the supervision of Prof. Matthew Mio. During his sophomore summer, he interned at the NASA Glenn Research Center where he helped develop flexible polyimide aerogels for conformal antennas with Dr. Mary Ann Meador. The following summer, he worked on additive manufacturing of polyimide aerogels with Dr. Mary Ann Meador and Dr. Michael Meador. Nick joined PME in the Fall of 2019 where he is co-advised by Prof. Shrayesh Patel and Prof. Stuart Rowan.
Nick’s research is focused on developing dynamic polymer networks for use in energy storage applications, specifically in batteries and thermoelectrics.
Accessing pluripotent materials through tempering of dynamic covalent polymer networks
Nicholas R Boynton, Joseph M Dennis, Neil D Dolinski, Charlie A Lindberg, Anthony P Kotula, Garrett L Grocke, Stephanie L Vivod, Joseph L Lenhart, Shrayesh N Patel, Stuart J Rowan. Science 383, 545-551 (2024)
Accessing pluripotent materials through tempering of dynamic covalent polymer networks
Nicholas R Boynton, Joseph M Dennis, Neil D Dolinski, Charlie A Lindberg, Anthony P Kotula, Garrett L Grocke, Stephanie L Vivod, Joseph L Lenhart, Shrayesh N Patel, Stuart J Rowan. Science, 383(6682), pp.545-551.
Connecting Molecular Exchange Dynamics to Stress Relaxation in Phase-Separated Dynamic Covalent Networks
Neil D. Dolinski, Ran Tao, Nicholas R. Boynton, Anthony P. Kotula, Charlie A. Lindberg, Kyle J. Petersen, Aaron M. Forster, and Stuart J. Rowan* ACS Macro Lett. 2024, 13, 2, 174–180
Enhancing the Equilibrium of Dynamic Thia-Michael Reactions through Heterocyclic Design
Alex E. Crolais, Neil D. Dolinski, Nicholas R. Boynton, Julia M. Radhakrishnan, Scott A. Snyder*, and Stuart J. Rowan*. J. Am. Chem. Soc. 2023, 145, 26, 14427–14434
Controlling the Morphology of Dynamic Thia-Michael Networks to Target Pressure-Sensitive and Hot Melt Adhesives
Katie M Herbert, Neil D Dolinski, Nicholas R Boynton, Julia G Murphy, Charlie A Lindberg, SJ Sibener, Stuart J Rowan. ACS Appl. Mater. Interfaces 2021, 13, 23, 27471–27480